[vc_row css_animation="" row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="5"][vc_column][vc_column_text css=".vc_custom_1498571182011{padding-bottom: 20px !important;}"] TECNOLOGIA 3D –MID [/vc_column_text][/vc_column][/vc_row][vc_row css_animation="" row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="7" padding_top="20"][vc_column][vc_column_text]3Dimensional Molded Interconnect (o Mechatronic Integrated) Device   Di cosa si tratta → Integrazione del PCB e relativa Elettronica con la Meccanica dell’applicazione finale.   Partnership ESSETI e...

[vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="5" css_animation=""][vc_column][vc_column_text css=".vc_custom_1453904982566{padding-bottom: 20px !important;}"] ALLUMINIO (IMS) [/vc_column_text][/vc_column][/vc_row][vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="7" padding_top="20" css_animation=""][vc_column][vc_column_text]I Circuiti Stampati in Alluminio (IMS - insulated Metal substrates) sono costituiti da una piastra di base metallica coperta da un sottile strato di...

[vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="5" css_animation=""][vc_column][vc_column_text css=".vc_custom_1453891528843{padding-bottom: 20px !important;}"] CIRCUITI STAMPATI RIGID FLEX [/vc_column_text][/vc_column][/vc_row][vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="7" padding_top="20" css_animation=""][vc_column][vc_column_text]Si adattano dove nessun altro può e danno libertà “illimitata” nella geometria del dispositivo mantenendo densità di precisione e ripetibilità dei circuiti.   Uno...

[vc_row css_animation="" row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="5"][vc_column][vc_column_text css=".vc_custom_1453898362533{padding-bottom: 20px !important;}"] CIRCUITI STAMPATI MULTILAYER (Multistrato) [/vc_column_text][/vc_column][/vc_row][vc_row css_animation="" row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="5"][vc_column][vc_column_text css=".vc_custom_1598282985531{padding-bottom: 20px !important;}"][iheu_ultimate_oxi id="16"][/vc_column_text][/vc_column][/vc_row][vc_row css_animation="" row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="7" padding_top="20"][vc_column][vc_column_text]Produrre circuiti stampati multistrato richiede un alto livello di attenzione...

[vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="5" css_animation=""][vc_column][vc_column_text css=".vc_custom_1453907895039{padding-bottom: 20px !important;}"] MONOLAYER E BILAYER (Monofaccia - Doppiafaccia) [/vc_column_text][/vc_column][/vc_row][vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="7" padding_top="20" css_animation=""][vc_column][vc_column_text]Si dice Monolayer quando il circuito stampato utilizza una sola faccia per la realizzazione delle piste. Il laminato impiegato è...

[vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="5" css_animation=""][vc_column][vc_column_text css=".vc_custom_1455030196267{padding-bottom: 20px !important;}"] BACK PANEL (WAFER PROBE CARD) [/vc_column_text][/vc_column][/vc_row][vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="7" padding_top="20" css_animation=""][vc_column][vc_column_text]Nella società High Tech di oggi i circuiti integrati semiconduttori sono essenziali. Sono presenti all’interno di una vasta gamma di prodotti,...

[vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="5" css_animation=""][vc_column][vc_column_text css=".vc_custom_1453891325683{padding-bottom: 20px !important;}"] CIRCUITI STAMPATI IN TEFLON (PTFE) [/vc_column_text][/vc_column][/vc_row][vc_row row_type="row" use_row_as_full_screen_section="no" type="full_width" angled_section="no" text_align="left" background_image_as_pattern="without_pattern" side_padding="7" padding_top="20" css_animation=""][vc_column][vc_column_text]Il Teflon per la sua struttura molecolare inerte è ideale per applicazioni che richiedo un elevato isolamento, soprattutto nel campo della...