Esseti | Multilayer PCB

MULTILAYER PCB

Produce Multilayer PCB requires a high level of attention to detail. Mostly choose carefully the materials, the sequence for the construction and the correct positioning of the blades, making sure that all layers are properly registered in the holes to prevent the deformation produced by the heat or pressure.

The outer layers of the multilayer are made from sheets of glass pre-impregnated with epoxy resin fabric and a thin copper sheet. The construction of a multilayer circuit can be compared to the construction of a microchip but in macro size with the advantage of being able to use more components such as capacitors, resistors or active devices embedded in the substrates.

Usually the multilayer PCB consists in an even number of layers, typically 4 or 6 but for particular applications or needs you can go up to 60 layers

Application Areas

Consumer electronics
Industrial electronics
Electro-medical
Automotive
Aerospace
Aeronautics
Military

Max Layers

Materials

FR4 – Laminated HTC (High Thermal Conductivity) – Roger – Arlon –Taconic-Teflon- FR4 ceramics – FR4 Tg 150-180-200 – FR4 a bassa Er – Laminated Halogen Free

Max Size

640×570 mm

Min CNC Drilling Size

0.1 mm

Min Laser Drilling Size

0.075 mm

Min Line width/Space

Standard: 0.05 mm
Custom: 0.025 mm

Impedance Tolerance Control

Standard: +/- 10 %
Custom: +/- 5 %

Base material thickness

0.6-0.8-1.0-1.2-1.6-2.0-2.4-3.2 mm

Base cooper thinckness

18-35-70-105-140-170-200 um

Surface Finishes

Passivated Copper (OSP) –Hot Air Levelling Lead Free HAL o Sn/Pb – Immersion Gold ( ENIG- ENIPIG-ASIG ) – Electrolytic Gold-Immersion Silver-Immersion Tin