Insulated metal substrate (IMS) consists of a metal baseplate covered by a thin layer of dielectric (usually an epoxy-based layer) and in this case instead of using the usual base material for the PCB , it is used aluminum as the carrier for the copper.
Thanks to this type of structure , the IMS can only accommodate components on the copper side and In most applications, the baseplate is attached to a heatsink to provide cooling, usually using thermal grease and screws.
For IMS PCB exists many combinations of thickness of the aluminum, insulating layer and copper and are suitable for applications in which electronics manages very high currents , up to several hundreds of Amperes with the need for thermal dissipation and ruggedness mechanics.
Application Areas
Aluminium IMS
Berquist – Ventec – KL Laminates – Isola- Zhejiang Huanzeng
1.0 – 1.5 – 2.0 – 3.0 mm
18-35-70-105-140-170-200 um
Passivated Copper (OSP) – HAL Lead Free or Sn/Pb – Immersion Gold (ENIG-ENIPIG-ASIG) – Electrolytic Gold-Immersion Silver – Immersion Tin
Green-blue-red-white-black-transparent. Some colors are also available in matt and glossy version
White, black, blue, yellow, red