3Dimensional Molded Interconnect (o Mechatronic Integrated) Device
What is it about? →
PCB and electronics Integration with mechanics final application
Partnership ESSETI and Multiple Dimensions →
Thanks to an important partnership established in 2016 at the Munich Electronica fair, with the Swiss company Multiple Dimension, today we can boast of being the first and only Italian PCB manufacturer to offer the exclusive 3D-MID technology.
Thanks to our thirty-year knowledge in PCB and our highly specialized staff we are able to accompany our customers in the process from standard technology to 3D-MID technology.
Advantages of 3D-MID technology:
NOTE: Maximum current for these applications: 2.3 °